MAPT Roadmap Conference

August 14-15, 2023

MICROELECTRONIC AND ADVANCED PACKAGING ROADMAP CONFERENCE

Microelectronics and Advanced Packaging Technologies (MAPT) is a critical multidisciplinary field with the potential to transform the design and manufacture of future microchips. These advances build upon breakthroughs in advanced packaging, 3D monolithic and 2.5D/3D heterogeneous integration, electronic design automation, nanoscale manufacturing, and energy-efficient computing. The main goal of the conference is to unveil the Microelectronic and Advanced Packaging Technologies Roadmap – an industry-wide initiative of major impact on the semiconductor and ICT industry, which will drive public-private research investments in support of the CHIPS Act. The conference will celebrate the first 3D semiconductor roadmap to guide the forthcoming microelectronic revolution, like the International Technology Roadmap for Semiconductors (ITRS) has served in the past.
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