Chapter 7 (Advanced Packaging and Heterogeneous Integration) focuses on various aspects of advanced packaging and heterogeneous integration of microelectronic chips. As the cost advantage of shrinking the die using finer transistor nodes (below 20nm) is diminishing, a new approach is necessary, which is to disaggregate a monolithic die into smaller chiplets cost-effectively fabricated on appropriate technology nodes. To enable functional scaling through heterogenous integration (HI) of the chiplets and passive components, the package must transition from a chip carrier/encapsulation to an integration platform. The proliferation of chiplets will continue as industry drives towards higher performance lower power solutions that are customized for each application. The next generation of packaging technology needs to support this explosion in heterogeneous integration by enabling interconnects that accommodate very fine pitch I/O die and very fine lines/spaces circuitry.