Introducing MAPT
This Interim Report of the MAPT Roadmap has been published to assist with the planning and execution of CHIPS Act initiatives. It provides an early version of the MAPT Roadmap Chapters, with items still under development. The team is now working towards an integrated final version with complete content, uniform style, and high-quality graphics. We seek feedback from the broader audience that can help to improve our Final Report (due October 31, 2023).
Supported by: National Institute of Standards and Technology (NIST)
Office of Advanced Manufacturing FEDERAL AWARD ID NUMBER: 70NANB22H039
Microelectronic and Advanced Packaging Technologies (MAPT) is a critical multidisciplinary field with the potential to transform the design and manufacture of future microchips. These advances build upon breakthroughs in advanced packaging, 3D monolithic and 2.5D/3D heterogeneous integration, electronic design automation, nanoscale manufacturing, and energy-efficient computing. The Semiconductor Research Corporation 2030 Decadal Plan for Semiconductors identified five seismic shifts to attack through innovative MAPT research and development:
The MAPT Technical Committee has identified the above as key drivers of MAPT innovation and have begun planning research in these areas. Advanced packaging is key to meeting the needs in these areas; the limits of transistor scaling will require assembling separately manufactured components to create advanced Systems in Package or SiPs. A critical contribution of this road mapping effort is to assure future design, development, and manufacturing of heterogeneously integrated SiPs in the US.
Public feedback requested
Please let us know your thoughts and comments about the interim versions of the chapters below
Public comment period closes May 1, 2023
